EB1620YA10-25.000M TR

EB1620 Series REGULATORY COMPLIANCE 2011/65 + 2015/863 191 SVHC ITEM DESCRIPTION Automotive Grade Quartz Crystal Resonator 1.6mm x 2.0mm x 0.55mm 4 Pad Ceramic Surface Mount (SMD) ELECTRICAL SPECIFICATIONS Nominal Frequency 16MHz to 54MHz Frequency Tolerance/Stability Aging at 25°C ±50ppm at 25°C, ±100ppm over -40°C to +85°C ±30ppm at 25°C, ±50ppm over -40°C to +85°C ±15ppm at 25°C, ±30ppm over -40°C to +85°C ±15ppm at 25°C, ±20ppm over -40°C to +85°C ±10ppm at 25°C, ±20ppm over -40°C to +85°C ±50ppm at 25°C, ±100ppm over -40°C to +105°C ±30ppm at 25°C, ±50ppm over -40°C to +105°C ±50ppm at 25°C, ±100ppm over -40°C to +125°C ±30ppm at 25°C, ±50ppm over -40°C to +125°C ±3ppm/year Maximum Load Capacitance Series Resonant, 8pF Parallel Resonant to 32pF Parallel Resonant Shunt Capacitance 3pF Maximum Equivalent Series Resistance 200 Ohms Maximum over Nominal Frequency of 16MHz to 19.999999MHz 120 Ohms Maximum over Nominal Frequency of 20MHz to 24.999999MHz 100 Ohms Maximum over Nominal Frequency of 25MHz to 39.999999MHz 60 Ohms Maximum over Nominal Frequency of 40MHz to 54MHz AT-Cut Fundamental Mode of Operation Drive Level Spurious Response Storage Temperature Range Insulation Resistance 100µWatts Maximum Measured from Fo to Fo +5000ppm -3dB Minimum -50°C to +150°C Measured at 100Vdc 500 Megaohms Minimum Revised A: 05/18/2018 Page 2 of 10 www.ecliptek.com EB1620 Series PART NUMBERING GUIDE Revised A: 05/18/2018 Page 3 of 10 www.ecliptek.com EB1620 Series MECHANICAL DIMENSIONS SUGGESTED SOLDER PAD LAYOUT PIN CONNECTION 1 Crystal 2 Cover/Ground 3 Crystal 4 Cover/Ground All Tolerances are ±0.1 All Dimensions in Millimeters Revised A: 05/18/2018 Page 4 of 10 www.ecliptek.com EB1620 Series TAPE & REEL DIMENSIONS Quantity per Reel: 3,000 Units All Dimensions in Millimeters Compliant to EIA-481 Revised A: 05/18/2018 Page 5 of 10 www.ecliptek.com EB1620 Series RECOMMENDED SOLDER REFLOW METHOD HIGH TEMPERATURE INFRARED/CONVECTION TS MAX to TL (Ramp-up Rate) Preheat - Temperature Minimum (TS MIN) - Temperature Typical (TS TYP) - Temperature Maximum(TS MAX) - Time (tS) Ramp-up Rate (TL to TP) Time Maintained Above: - Temperature (TL) - Time (tL) Peak Temperature (TP) 3°C/Second Maximum 150°C 175°C 200°C 60 - 180 Seconds 3°C/Second Maximum 217°C 60 - 150 Seconds 260°C Maximum for 10 Seconds Maximum Target Peak Temperature(TP Target) 250°C +0/-5°C Time within 5°C of actual peak (tp) 20 - 40 Seconds Ramp-down Rate 6°C/Second Maximum Time 25°C to Peak Temperature (t) 8 Minutes Maximum Moisture Sensitivity Level Level 1 Additional Notes Temperatures shown are applied to body of device. High Temperature Manual Soldering 260°C Maximum for 5 Seconds Maximum, 2 times Maximum. (Temperatures shown are applied to body of device.) Revised A: 05/18/2018 Page 6 of 10 www.ecliptek.com EB1620 Series RECOMMENDED SOLDER REFLOW METHOD LOW TEMPERATURE INFRARED/CONVECTION TS MAX to TL (Ramp-up Rate) Preheat - Temperature Minimum (Ts MIN) - Temperature Typical (Ts TYP) - Temperature Maximum(Ts MAX) - Time (ts) Ramp-up Rate (TL to TP) Time Maintained Above: - Temperature (TL) - Time (tL) Peak Temperature (TP) 5°C/Second Maximum N/A 150°C N/A 30 - 60 Seconds 5°C/Second Maximum 150°C 200 Seconds Maximum 245°C Maximum Target Peak Temperature (TP Target) 245°C Maximum 2 Times / 230˚C Maximum 1 Time Time within 5°C of actual peak (tp) 10 Seconds Maximum 2 Times / 80 Seconds Maximum 1 Time Ramp-down Rate 5°C/Second Maximum Time 25°C to Peak Temperature (t) N/A Moisture Sensitivity Level Level 1 Additional Notes Temperatures shown are applied to body of device. Low Temperature Manual Soldering 185°C Maximum for 10 Seconds Maximum, 2 times Maximum. (Temperatures shown are applied to body of device.) Revised A: 05/18/2018 Page 7 of 10 www.ecliptek.com